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发明公开
CN105529306A 半导体部件 有权

半导体部件
摘要：
本发明涉及半导体部件。提供了半导体部件，其包括内部半导体部件壳体和外部半导体部件壳体。内部半导体部件壳体包括半导体芯片、第一塑料壳体组成物和第一壳体接触表面，其中半导体芯片的至少边缘嵌在第一塑料壳体组成物中。第一壳体接触表面没有第一塑料壳体组成物并包括第一布置。外部半导体部件壳体包括第二塑料壳体组成物和第二壳体接触表面，其包括第二布置。内部半导体部件壳体位于外部半导体部件壳体内并嵌在第二塑料壳体组成物中。内部半导体部件壳体的第一壳体接触表面中的至少一个与第二半导体部件壳体的第二壳体接触表面中的至少一个电连接。
摘要（英）：

A semiconductor component includes an inner semiconductor component housing and an outer semiconductor component housing. The inner semiconductor component housing includes a semiconductor chip, a first plastic housing composition and first housing contact surfaces. At least side faces of the semiconductor chip are embedded in the first plastic housing composition and the first housing contact surfaces are free of the first plastic housing composition and include a first arrangement. The outer semiconductor component housing includes a second plastic housing composition and second housing contact surfaces which include a second arrangement. The inner semiconductor component housing is situated within the outer semiconductor component housing and is embedded in the second plastic housing composition. At least one of the first housing contact surfaces is electrically connected with at least one of the second housing contact surfaces.

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