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发明公开
CN105529375A 内建光障组件的封装结构、光学封装结构及其形成方法 有权

内建光障组件的封装结构、光学封装结构及其形成方法
摘要：
本发明公开了一种内建光障组件的封装结构、光学封装结构及其形成方法。所述内建光障组件的封装结构包含基板、发光组件、感光组件、光障组件、以及封装材料。所述发光组件位于所述基板上并用于发出光讯号。所述感光组件位于所述基板上并用于接收所述光讯号。所述光障组件位于所述基板上以及位于所述发光组件与所述感光组件之间，而用于屏障多余的所述光讯号。所述封装材料用来完全覆盖所述发光组件与所述感光组件，而使得所述光障组件完全位于所述封装材料中。
摘要（英）：

A package structure with an optical barrier is provided. An emitter for emitting an optical signal and a detector for receiving the optical signal are disposed on a substrate. The optical barrier is disposed between the emitter and the detector for shielding the excess optical signal. A package material is used to completely cover the optical barrier, the emitter and the detector so that the optical barrier is completely disposed within the package material.

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