The present invention provides a wafer processing tape capable of reducing the generation of a label mark and also reducing the mixing of air between a release film and an adhesive layer. The present invention includes: a long release film (11); an adhesive layer (12) installed on a first surface of the release film (11) and having a predetermined plane shape; a label part (13a) covering the adhesive layer (12), installed to touch the release film (11) around the adhesive layer (12), and having a predetermined plane shape; an adhesive film (13) including a neighboring part (13b) surrounding the outer part of the label part (13a); and a support member (14) installed to hang on an area on a second surface, which is opposite to the first surface of the release film (11), corresponds to an end part of the adhesive layer (12) in a lateral direction of the release film (11), and is both lateral ends of the release film (12).