The invention provides a machining method for a circuit board. The machining method is characterized by comprising the steps of providing a barrier frame, wherein the barrier frame is provided with a first surface and a second surface that are arranged in a relative manner; through holes are formed in the barrier frame; the through holes extend from the first surface to the second surface; providing a circuit board, wherein a first solder resist ink layer is arranged on the surface of the circuit board; putting the barrier frame on the circuit board; enabling the second surface to be in contact with the surface of the circuit board or the surface of the first solder resist ink layer, wherein the first surface is higher than the surface of the first solder resist ink layer; and coating the surface of the first solder resist ink layer with second solder resist ink, wherein the second solder resist ink is blocked in the through holes by the barrier frame. According to the machining method for the circuit board provided by the invention, the barrier frame with the through holes is provided; the surface of the first solder resist ink is coated with the second solder resist ink; the barrier frame is placed on the circuit board; the second solder resist ink is blocked in the through holes by the barrier frame; and therefore, the second solder resist ink is prevented from flowing out of the through holes, and the second solder resist ink covering the first solder resist ink layer achieves the appointed thickness.