The invention provides a staggered laminated three-dimensional packaging structure of LTCC substrates.The packaging structure comprises the bottom layer LTCC substrate, the middle layer LTCC substrates and the top layer LTCC substrate; the number of the middle layer LTCC substrates is at least two, chip cavity grooves are formed in each LTCC substrate, the LTCC substrates are stepwise arranged in a vertically staggered mode, the bottom layer, middle layer and top layer LTCC substrates are electrically connected through gold wires or straps, and mechanical support and common-ground connection are achieved through stickup of conductive glue.The multiple traditional LTCC substrates are laminated in a staggered mode to achieve the three-dimensional packaging structure, and as the adjacent layers are staggered, a partial region in a staggered electric connection region on each layer can be saved for placing an accessory large in size; the packaging structure can be obtained by using a conventional LTCC substrate machining technology, a gold wire and gold strap bonding technology and a conductive glue stickup technology, is simple in process and has the advantages of being high in mechanical strength, large in contact area between the adjacent layers, small in circuit size and the like.