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发明公开
CN105849899A 防水型电子设备以及其制造方法 有权

防水型电子设备以及其制造方法
摘要：
防水型电子设备具备：电子部件构造体，其具备包括半导体元件的电子部件、以能够进行热传导的方式设于电子部件的散热部件、以及以使散热部件的一面露出的方式对电子部件的周围进行覆盖的绝缘件；以及防水膜，其至少形成于电子部件构造体的浸渍于制冷剂的浸渍区域的整个面。
摘要（英）：

This waterproof electronic device contains an electronic-component structure and a waterproof membrane that is formed on at least the entire surface of the electronic-component structure that is immersed in a refrigerant. The electronic-component structure comprises the following: an electronic component that contains a semiconductor element; a heat-dissipating member that is provided such that heat can be transferred thereto from the electronic component; and insulation that surrounds the electronic component so as to expose one surface of the heat-dissipating member.

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