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发明授权
CN105914284B 一种溶液法荧光粉胶薄膜涂覆方法、产品以及应用 有权

一种溶液法荧光粉胶薄膜涂覆方法、产品以及应用
摘要：
本发明公开了一种溶液法荧光粉胶薄膜涂覆方法及其在晶圆级发光二极管封装中的应用，属于LED封装领域。其包含：S1将荧光粉胶涂覆在LED晶圆片上；S2将LED晶圆片置于温度为50℃～200℃度的溶液中；S3待荧光粉胶形貌稳定后，将LED晶圆片从溶液中取出；S3将LED晶圆片置于温度在50℃～200℃下加热，使残留在LED晶圆片和荧光粉胶表面上的溶液蒸发并将荧光粉胶固化；S5将晶圆片切割成小芯片单元。本发明方法操作简单，成本低，可制备厚度极薄且厚度均匀度大于0.95的荧光粉胶薄膜，从而提高LED的光效、空间颜色均匀性以及产品一致性。该工艺可以广泛的应用于晶圆级发光二极管封装中。
摘要（英）：

The invention discloses a solution method based phosphor glue film coating method and an application thereof in wafer level light emitting diode package, and belongs to the field of LED package. The method comprises the following steps: S1, applying phosphor glue to an LED water; S2, putting the LED wafer in a solution at the temperature of 50-200 DEG C; S3, after the morphology of the phosphor glue is stabilized, taking the LED wafer out of the solution; S4, heating the LED wafer at the temperature of 50-200 DEG C to evaporate the solution left on the surface of the LED wafer and the phosphor glue and cure the phosphor glue; and S5, cutting the wafer into small chip units. The method of the invention is simple to operate and low in cost. A phosphor glue film which is extremely thin and has thickness uniformity greater than 0.95 can be prepared, and the light effect and space color uniformity of LEDs and the consistency of products can be improved. The technology can be widely applied to wafer level light emitting diode package.

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