The invention provides an inductively coupled plasma device, and relates to the technical field of display. The etching uniformity can be improved. The inductively coupled plasma device comprises a reaction chamber, dielectric coupling plates and coils, wherein the coils are arranged at the upper parts of the dielectric coupling plates; the dielectric coupling plates are of a structure with at least two layers; the dielectric coupling plates are divided into a plurality of regions; each region is also provided with an electric field adjusting structure; and each electric field adjusting structure is located between two adjacent layers of dielectric coupling plates, and is used for adjusting the intensity of an electric field which enters the reaction chamber through each region. The inductively coupled plasma device is used for dry etching.