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发明公开
CN105990179A 用于双重区域分割的系统和方法 有权

用于双重区域分割的系统和方法
摘要：
本公开涉及用于双重区域分割的系统和方法。其中，一种用于半导体制造的方法包括形成通过分割区域和接触区域分离的半导体电路的第一阵列和半导体电路的第二阵列。该方法还包括在衬底的分割区域内形成工艺控制监控结构的第一阵列。该方法还包括形成设置在接触区域中的接触焊盘的第一阵列。该方法还包括形成工艺控制监控结构的第一阵列与接触焊盘的第一阵列之间的电连接，其中工艺控制监控结构的第一阵列的所有外部电连接均被制造为穿过接触焊盘的第一阵列。
摘要（英）：

The disclosure relates to a system and method for dual-region singulation. Wherein, a method for semiconductor fabrication includes forming a first array of semiconductor circuitry and a second array of semiconductor circuitry separated by a singulation region and a contact region. The method also includes forming a first array of process control monitoring structures within the singulation region of a substrate. The method also includes forming a first array of contact pads disposed in the contact region. The method also includes forming electrical connections between the first array of process control monitoring structures and the first array of contact pads, wherein all external electrical connections to the first array of process control monitoring structures are made through the first array of contact pads.

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