The present invention is provided with: a stage (20) that includes an adsorption surface (22) for adsorbing a dicing sheet (12); a stepped surface formation mechanism (300) that is disposed inside an opening (23) in the stage (20), includes a plurality of moving elements (30) having a front-end surface that moves between a first position which is higher than the adsorption surface (22) and a second position which is lower than the first position, and forms a stepped surface in relation to the adsorption surface (22); an opening pressure switching mechanism (80) that switches the opening pressure of the opening (23) between a first pressure (P1) which is close to a vacuum and a second pressure (P2) which is close to atmospheric pressure. During pickup of the semiconductor die (15), at least one moving element (30) is moved from the first position to the second position every time the opening pressure is switched from the first pressure (P1) to the second pressure (P2). Thanks to this, the occurrence of damage to the semiconductor die is suppressed, and the semiconductor die is picked up effectively.