The invention relates to a circuit carrier. The circuit carrier comprises at least one electronic component which is soldered to said circuit carrier, in particular, using a flux agent. The circuit carrier comprises a protective layer, particularly an electrically-insulating protective layer, to provide protection from condensation, one surface of said circuit carrier being at least partially covered by said protective layer. According to the invention, the circuit carrier protective layer is formed by a silicone polymer layer designed to be activatable using ultraviolet radiation, said silicone polymer layer comprising filler particles that are distributed in said silicone polymer layer, in particular in a uniform manner. At least one portion of the filler particles, or all of the filler particles, comprise(s) at least one salt of an alkaline earth metal.