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发明授权
CN106337199B 用于减少晶片粘着的集成的弹性体唇状密封件和杯底 有权

用于减少晶片粘着的集成的弹性体唇状密封件和杯底
摘要：
本公开涉及用于减少晶片粘着的集成的弹性体唇状密封件和杯底。所公开的是用于在电镀过程中保持、密封和提供电功率给晶片的电镀杯件，其中所述电镀杯件可包括杯底、弹性体唇状密封件和电触头元件。所述杯底可包括具有多个通孔的径向向内突出表面。所述弹性体唇状密封件可直接粘附到杯底的径向向内突出表面，填充所述多个通孔，并围绕所述杯底的内缘。在一些实施方式中，这可减轻晶片粘着的影响。在一些实施方式中，杯底可被处理以促进所述弹性体唇状密封件和所述杯底的径向向内突出表面之间的粘附。
摘要（英）：

Disclosed are electroplating cups for holding, sealing, and providing electrical power to wafers during electroplating, where the electroplating cup can include a cup bottom, an elastomeric lipseal, and an electrical contact element. The cup bottom can include a radially inwardly protruding surface with a plurality of through-holes. The elastomeric lipseal can directly adhere to the radially inwardly protruding surface of the cup bottom, fill the plurality of through-holes, and encircle an inner edge of the cup bottom. In some implementations, this can mitigate the effects of wafer sticking. In some implementations, the cup bottom may be treated to promote adhesion between the elastomeric lipseal and the radially inwardly protruding surface of the cup bottom.

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