The present invention relates to a 3G radio frequency power amplifier circuit module. The 3G radio frequency power amplifier circuit module comprises a first-stage amplification structure and a second-stage amplification structure connected with the first-stage amplification structure by using an inter-stage matching circuit. The first-stage amplification structure comprises a radio frequency amplification transistor T1, an input matching circuit matched with the radio frequency amplification transistor T1, and an amplification transistor T1 bias circuit matched with the radio frequency amplification transistor T1. The second-stage amplification structure comprises a radio frequency amplification transistor T2, an output matching circuit matched with the radio frequency amplification transistor T2, and an amplification transistor T2 bias circuit matched with the radio frequency amplification transistor T2. The first-stage amplification structure is connected with the second-stage amplification structure by using the inter-stage matching circuit, and none of the input matching circuit of the first-stage amplification structure, the output matching circuit of the second-stage amplification structure, and the inter-stage matching circuit use an SMD capacitor and an SMD inductor, so that the encapsulation capacity is improved effectively, the encapsulation cost is reduced, and the encapsulation adaptability is improved. The 3G radio frequency power amplifier circuit module is safe and reliable.