Embodiments of the invention provide a chip packaging structure. The chip packaging structure comprises a substrate, a plurality of chips and a plurality of separation devices which are packaged on the upper surface of the substrate, and a heat dissipation apparatus, wherein the heat dissipation apparatus comprises an insulating layer and a heat conduction layer which are arranged in a laminating manner; and the insulating layer fully coats and is attached to the outer surfaces of the multiple chips and separation devices and the upper surface of the substrate, and is used for transferring heat generated by the multiple chips and separation devices to the heat conduction layer and the substrate, so as to dissipate the heat generated by the multiple chips and separation devices through the heat conduction layer and the substrate. In addition, the embodiments of the invention also provide a manufacturing method for the chip packaging structure. The chip packaging structure, by setting the heat dissipation apparatus, can realize uniform and efficient system-level chip packaging heat dissipation.