The invention belongs to the technical field of preparation and processing of a target material, and particularly relates to a surface treatment method of a high pure metal sputtering target material. The surface treatment method comprises the following steps: the target material is firstly subjected to surface precision machining, surface grinding and surface cleaning and then subjected to rapid surface heat treatment by adopting a continuous wave laser heat treatment method, an electron beam scanning method or noncoherent broadband frequency light source method, a hardened layer on the surface of the target material recrystallizes through the skin effect generated by rapid heat treatment, stress and dislocation in the hardened layer is eliminated, and a recrystallization texture basically consistent with the matrix is obtained. The surface treatment method is simple in process, high in speed, high in universality, suitable for target materials of different sizes, free of material pollution during the preparation process, low in material loss and environment friendly.