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CN107020574A 化学机械研磨修整器及其制造方法 无效 - 撤回

化学机械研磨修整器及其制造方法
摘要：
一种化学机械研磨修整器及其制造方法，该化学机械研磨修整器包括一基板以及至少一研磨单元，该研磨单元设置于该基板上，该研磨单元分别包括一支撑层、一研磨层以及一应力抵销层，该支撑层具有一远离该基板的工作面以及一与该工作面相对的非工作面，该研磨层设置于该支撑层的该工作面，且该研磨层是利用化学气相沉积法所形成的一第一钻石镀膜，该第一钻石镀膜具有多个研磨尖端，该应力抵销层设置于该支撑层的该非工作面，该应力抵销层是利用化学气相沉积法所形成的一第二钻石镀膜。该应力抵销层可发挥抵销热应力的效果，减少该支撑层的翘曲或变形。
摘要（英）：

A chemical mechanical polishing conditioner comprises a substrate and at least one abrasive unit. The abrasive unit is provided on the substrate, and the abrasive unit comprises a supporting layer, an abrasive layer and a stress-relief layer. The supporting layer is provided with a working face far away from the substrate and a non-working face opposite to the working face. The abrasive layer is provided on the working face of the supporting layer, and the abrasive layer is a first diamond-plated film formed by chemical vapor deposition method. The first diamond-plated film is provided with a plurality of abrasive tips. The stress-relief layer is provided on the non-working face of the supporting layer, and the stress-relief layer is a second diamond-plated film formed by chemical vapor deposition method. A thermal stress-relieving effect may be exerted by the stress-relief layer, so as to reduce warpage or deformation of the supporting layer.

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