The invention discloses a PCB solder resist production method, comprising the following steps of S1, spraying printing ink of which viscosity is 55-65dpa.s on a surface of a PCB through adoption of an air pressure spraying technology, thereby forming a first printing ink layer, wherein the thickness of the first printing ink layer is 10-15mum; S2, spraying the printing ink of which viscosity is 55-65dpa.s on the surface of the first printing ink layer through adoption of an electrostatic spraying technology, thereby forming a second printing ink layer, wherein the thickness of the second printing ink layer is 70-80mum; S3, prebaking the first printing ink layer and the second printing ink layer; and S4, exposing and developing the first printing ink layer and the second printing ink layer and then baking and solidifying the first printing ink layer and the second printing ink layer. According to the method provided by the invention, after the first printing ink layer is formed through air pressure spraying, standing and baking processes are avoided, so the production efficiency of the printed circuit board is improved; the thickness of the second printing ink layer formed through an electrostatic spraying process is controlled at 75+/-5mum, so the quality problem that circuit angles of board edges are red due to the fact that circuit gaps are printing ink proof because the thickness of the second printing ink layer formed through the electrostatic spraying is too low is reduced; and the production of tools such as an earlier stage screen and a bed of nails is reduced, so the solder resist cost is reduced.