The invention discloses a cutting method capable of lowering influence on scribing quality from a test pattern. According to the method, a first scribing knife with relatively high thickness and relatively low rotating speed is adopted to perform scribing and cutting on the test pattern on a wafer scribing channel; and then a second scribing knife with relatively narrow thickness and relatively high rotating speed is adopted to perform scribing and cutting on a wafer. By adoption of the method, the test pattern on the wafer scribing channel can be effectively removed by cutting, so that a wafer chipping phenomenon in the test pattern scribing and cutting process can be avoided; and meanwhile, risk of generation of remainders in an integrated circuit can be lowered, the technological cost is low, and the application range is wide.