The invention relates to a method for enabling the surfaces of TiB2 particles to be plated with copper, and belongs to the technical field of functional materials. The method for enabling the surfaces of the TiB2 particles with the copper comprises the following steps that the roughed and sensitized TiB2 particles are dispersed in ethyl alcohol, an activation solution is added for activation, then, solid-liquid separation is carried out, a solid phase is washed till washing liquid is neutral, the washed solid phase is dispersed in ethyl alcohol, and a copper plating solution is added for copper plating, wherein the activation solution is obtained when ammonium hydroxide is added into a silver nitrate solution till the system is transparent. According to the method for enabling the surfaces of the TiB2 particles to be plated with the copper, a layer of matrix metal is deposited on the surfaces of the particles through an oxidation-reduction reaction in advance, the wettability of the interface between the TiB2 particles and metal can be remarkably improved, the surfaces of the TiB2 particles are evenly plated with the copper, and the TiB2 particles plated with the copper can be widely used for preparing metal matrix composite materials and ceramic materials.