Provided is a roughened copper foil which, when used in the SAP method, can endow a laminate with a surface profile excellent not only in plated circuit adhesion but also in etching performance for electroless copper plating and dry film resolution. This roughened copper foil has a roughened surface on at least one side, wherein: the roughened surface is provided with a plurality of substantially spherical projections composed of copper particles; the mean height of the substantially spherical projections is 2.60 μm or less; and the ratio bave/aave of the mean maximum diameter bave of the substantially spherical projections to the mean neck diameter aave of the substantially spherical projections is 1.2 or higher.