The invention relates to a pressurization device applied to thick film hot press sintering, a thermoelectric thick film and a flexible thermoelectric device. The pressurization device comprises multiple compression spring assemblies, a first press plate, a second press plate, a top plate and a bottom plate, wherein the bottom plate is used for placing a thick film; the first press plate is placedabove the thick film and is contacted with the thick film; sizes of the first press plate and a thick film substrate are matched; the second press plate is placed above the first press plate; the topplate is placed above the second press plate; one end of each compression spring assembly is fixedly connected with one end of the bottom plate and the other end of each compression spring assembly penetrates through one end of the second press plate and the top plate respectively; and each compression spring assembly comprises a compression spring, and two ends of the compression spring abut against the upper surface of the second press plate and the lower surface of the top plate. The flexible thermoelectric device manufacturing method has the advantages that the process is simple, the manufacturing controllability is strong, and the production cost is low, the inner resistance of the manufactured thermoelectric device is small, and a unique advantage in the thermal management application field of electronic elements is achieved.