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发明公开
CN107984110A 一种低温无铅焊料合金 无效 - 驳回

一种低温无铅焊料合金
摘要：
本发明公开了一种低温无铅焊料合金，属于电子焊接技术领域。本发明的低温无铅焊料合金按重量百分计，包含Bi：20~50%；Sb：0.5~10%；In：0.5~10%；Ge：0~0.20%；P：0~0.11%；并包含以下元素的两种或两种以上：Ni：0~0.2％；Co：0~0.2％；Ga：0~0.11%；0~0.2％的Si；0~0.5％的Al；0~0.5％的Zn；余量为Sn和不可避免的杂质。本发明通过Sb、In、Ni、Co、Ge等多元合金元素的添加，可以明显改变焊料合金的机械性能，在形成的焊点中，界面处，弥散分布的多元合金元素阻碍Bi的富集，防止富Bi相的产生，减少硬而脆的富Bi相对焊接接头机械性能的损害，提高了焊料合金的焊接性能。
摘要（英）：

The invention discloses a low-temperature lead-free solder alloy, and belongs to the technical field of electronic welding. The low-temperature lead-free solder alloy comprises, by weight percentage,20-50% of Bi, 0.5-10% of Sb, 0.5-10% of In, 0-0.20% of Ge and 0-0.11% of P; two or more than two types of 0-0.2% of Ni, 0-0.2% of Co, 0-0.11% of Ga, 0-0.2% of Si, 0-0.5% of Al and 0-0.5% of Zn; and the balance of Sn and inevitable impurities. According to the low-temperature lead-free solder alloy, multi-element alloy elements such as the Sb, the In, the Ni, the Co, the Ge and the like are added so that the mechanical performance of the solder alloy can be obviously changed; and in formed welding spots and interfaces, the multi-element alloy elements in the dispersed distribution block enrichment of the Bi and prevent generation of rich Bi phases, so that damage of the hard and brittle rich Bi phases to the mechanical property of welding joints is reduced, and the welding performance of the solder alloy is improved.

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