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发明公开
CN108091590A 半导体制造装置及基板支承装置的冷却方法 无效 - 撤回

半导体制造装置及基板支承装置的冷却方法
摘要：
本发明提供一种半导体制造装置及基板支承装置的冷却方法。使用简单的结构在短时间内使基板支承装置的温度下降。半导体制造装置具备：收纳处理基板的第一收纳室；收纳伪基板的第二收纳室；对基板进行支承的带有加热功能的基板支承装置；及在各收纳室与基板支承装置之间进行各基板的搬运的基板搬运装置，其中，所述半导体制造装置还具备控制装置，控制装置在前面的基板处理中的基板处理温度比后面的基板处理中的基板处理温度高的情况下，在进行后面的基板处理之前对基板搬运装置进行操作，对温度比前面的基板处理中的基板处理温度低的伪基板进行搬运。
摘要（英）：

A semiconductor manufacturing apparatus and a method for cooling a substrate support apparatus are provided. The substrate support apparatus is cooled in short time by a simple structure. The semiconductor manufacturing apparatus is provided with a first storage chamber that stores a substrate to be processed, a second storage chamber that stores a dummy substrate, a substrate support apparatus with a heating function that supports a substrate, and a substrate transport apparatus that transports the substrates between the storage chambers and the substrate support apparatus. The semiconductormanufacturing apparatus is further provided with a controller which, in the event that the temperature of substrate processing in a preceding substrate processing step is higher than the temperature of substrate processing in a subsequent substrate processing step, operates the substrate transport apparatus to transport the dummy substrate, whose temperature is lower than the temperature of substrate processing in the preceding substrate processing step, prior to carrying out the subsequent substrate processing step.

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