A conveyance apparatus that conveys a substrate is disclosed. A soldering device for the conveyance apparatus contains a substrate loading portion configured to load the substrate on the conveyance apparatus, an intermittent feeding unit configured to intermittently feed the substrate loaded on the conveyance apparatus, a substrate discharge portion configured to discharge the intermittently fed substrate to the outside of the conveyance apparatus, and a controller configured to control conveyance of the substrate, said substrate loading portion, said intermittent feeding unit, said substratedischarge portion being arranged from an upstream side to a downstream side along a substrate conveyance direction, wherein the substrate loading portion having a substrate loading inlet includes a first conveyance path configured to convey the substrate, a first sensor provided in the vicinity of the substrate loading inlet thereof, and a second sensor arranged in a downstream side of the first sensor along the substrate conveyance direction, and wherein the intermittent feeding unit having an upstream end along the substrate conveyance direction includes a second conveyance path for conveying the substrate, and a third sensor placed in the vicinity of the upstream end thereof.