The invention provides a novel rapid solidification low-temperature conductive silver paste and a preparation method therefor, and belongs to the field of electronic paste of information function newmaterials. The conductive silver paste contains the following components by mass percentage: 45-55% of silver powder, 5-12% of thermoplastic resin, 0.5-1% of thermosetting resin, 0.1-0.5% of heat curing agent, 1-2% of an addition agent and 30-45% of a solvent, wherein the sum of the weight percentages of the components is 100%. The prepared conductive silver paste is short in solidification time,and is completely solidified in 1-2 min under the temperature of 150 DEG C. The conductive silver paste is suitable for precise screen printing. The resolution can reach 100*100 microns, the conductive silver paste is 5B after solidification, and the hardness is greater than 2H. The printing thickness is 4-6 microns, the resistance change rate is less than 280% after 10 forwarding and reverse folding times, and the resistivity is less than 3.5*10<-5>ohm*cm.