The invention discloses integrated circuit packaging equipment, which comprises a bottom plate, wherein bilaterally symmetrical feet are fixedly arranged on the lower end surface of the bottom plate;the feet are propped against the ground; a penetrating cavity which penetrates up and down is fixedly arranged in the bottom plate; upright posts are fixedly arranged on the upper end surface of the bottom plate in a bilaterally symmetrical manner; a bottom conveyor which is driven by a motor is fixedly arranged on the upper end surface of each upright post; a top plate is arranged at the upper part of the penetrating cavity; bilaterally symmetrical poles are fixedly arranged on the lower end surface of the top plate; the poles are fixed to the bottom plate; a lifting cylinder is fixedly arranged in the top plate; a push rod of the lifting cylinder penetrates through the top plate in a sliding manner and extends upwards; a top block is fixedly arranged on the upper end surface of the pushrod of the lifting cylinder; slide bars are fixedly arranged on the lower end surface of the top block in a bilaterally symmetrical manner; and the slide bars penetrate through the top plate in a sliding manner and extend downwards. The integrated circuit packaging equipment is simple in structure and convenient to use; and multi-mechanism coordinated operation is adopted by the equipment, so thatthe automatic packaging process of an integrated circuit is achieved and the work efficiency of the equipment is effectively improved.