The invention relates to a large-power solid relay packaging structure. The large-power solid relay packaging structure comprises a leading wire framework, wherein an outer side of the leading wire framework is wrapped in a plastic-sealed body, the leading wire framework comprises first, second and third carrier islands and an output lineup island, the first carrier island is connected with a first outer leading wire pin, the third carrier island is connected with a fourth outer leading wire pin, the output lineup island is connected with a second leading wire pin, the first carrier island isequipped with an output chip, the area of the first carrier island is relatively large, the second carrier island is equipped with a photoelectric conversion chip, the third carrier island is equippedwith a light-control chip, the second carrier island and the third carrier island are adjacent to each other, the photoelectric conversion chip is bonded with the output chip, the light-control chipis bonded with a third outer leading wire pin, the output chip is bonded with the output lineup island, the first and second leading wire pins are two terminals of an output switch, and the third andfourth outer leading wire pins are two terminals of a control end. The large-power solid relay packaging structure is advantaged in that the conversion chip is made to effectively receive a light source, rapid response of the conversion chip is realized, and no stratification occurs.