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发明公开
CN108688278A 一种PTFE基PCB覆铜板及压合方法 审中-实审

一种PTFE基PCB覆铜板及压合方法
摘要：
本发明涉及一种PTFE基PCB覆铜板及制备方法，包括PTFE基半固化片、缓冲层和铜板，铜板与铜板之间均设有PTFE基半固化片，且PTFE基半固化片的表面均设有缓冲层与铜板接触，起码设有上下两层铜板与夹在铜板间的PTFE基半固化片及缓冲层对齐压合连接。通过施加缓冲层对PTFE基PCB覆铜板进行压合得到PTFE基PCB板材的铜板在半固化片上附着更牢固，对5G时代高频PCB覆铜板的应用具有重要作用。
摘要（英）：

The invention relates to a PTFE-based PCB copper clad laminate and a preparation method thereof, the PTFE-based PCB copper clad laminate comprises PTFE-based prepregs, buffer layers and copper plates,the PTFE-based prepregs are arranged between the copper plates, and the surfaces of PTFE-based prepregs are provided with the buffer layers for contact with the copper plates. At least an upper copper plate and a lower copper plate and the PTFE-based prepreg and the buffer layers sandwiched between the copper plates are aligned and laminated. The PTFE-based PCB clad laminate is pressed by applying of the buffer layers, the copper plates of the obtained PTFE-based PCB copper clad laminate are more firmly attached to the prepregs, and the PTFE-based PCB copper clad laminate plays an important role in the application of high-frequency PCB copper clad laminates in the 5G era.

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