The invention discloses a three-dimensional integrated intelligent power module and a manufacturing method thereof. The three-dimensional integrated intelligent power module comprises a power switch circuit, a drive circuit, a master control circuit and a state monitoring and protecting circuit and is characterized in that the master control circuit and the state monitoring and protecting circuitare connected with the power switch circuit and the drive circuit thereof, the master control circuit is assembled to an upper substrate, the state monitoring and protecting circuit is assembled to alower substrate, the upper substrate and the lower substrate are connected with each other by through guide holes to form a three-dimensional intelligent control unit, and the power switch circuit andthe drive circuit thereof are welded to a high-heat-conductivity substrate and connected with the intelligent control unit through lead welding. The intelligent power module has the advantages that the intelligent power module integrates the power switch circuit and the drive circuit thereof, the master control circuit and the state monitoring and protecting circuit; by using the three-dimensional integration form, module power density can be increased, device size can be reduced, the length of the lead between power semiconductor device pins is shortened, parasitic parameters and noise peakvoltage are lowered, and the application reliability of power devices is increased.