The invention relates to an electroplating device for a wafer and an electroplating method of the electroplating device. The electroplating device comprises an electroplating container, a wafer base,an anode electrode and an external power supply assembly, wherein the electroplating container is used for containing electroplating liquid; the wafer base is arranged in the electroplating containerand used for fixing the wafer, and the surface of the fixed wafer is immersed in the electroplating liquid; the anode electrode is positioned in the electroplating container and immersed in the electroplating liquid; and the external power supply assembly is positioned outside the electroplating container, a first pole of the external power supply assembly is electrically connected with the anodeelectrode, and a second pole of the external power supply assembly is electrically connected with the wafer base. By means of the electroplating device and the electroplating method, the electroplating quality of a metal layer can be improved, and the quality of a semiconductor device can be further improved.