The invention provides a substrate processing apparatus which includes: a processing liquid supply unit (60) which comprises a processing liquid nozzle (61); and a processing liquid nozzle driving unit (65) that moves the processing liquid nozzle (61) among a first processing position (P1), a second processing position (P2) which is positioned closer to a center side of the substrate than the first processing position (P1), and a retreat position (Q1) that is retreated from the substrate. In a first moving step, the processing liquid nozzle discharges the processing liquid and is moved from the retreat position (Q1) to the first processing position (P1) while rotating the substrate at a first rotational speed (R1), and in a second moving step after the first moving step, the processing liquid nozzle discharges the processing liquid and is moved from the first processing position (P1) to the second processing position (P2) while rotating the substrate at a second rotational speed (R2) that is higher than the first rotational speed (R1). Therefore, particle generation on the upper surface of the substrate can be suppressed.