Integrated circuits with magnetic random access memory (MRAM) devices and methods for fabricating such devices are provided. In an exemplary embodiment, a method for fabricating MRAM bitcells includesdetermining a desired inter-cell spacing between a first bitcell and a second bitcell and double patterning a semiconductor substrate to form semiconductor fin structures, wherein the semiconductor fin structures are formed in groups with an intra-group pitch between grouped semiconductor fin structures and with the inter-cell spacing between adjacent groups of semiconductor fin structures different from the intra-group pitch. The method further includes forming a first MRAM memory structure over the semiconductor fin structures in the first bitcell and forming a second MRAM memory structureover the semiconductor fin structures in the second bitcell. Also, the method includes forming a first source line for the first bitcell between the first MRAM memory structure and the second MRAM memory structure.