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发明公开
CN110164782A 封装结构及组件连接的方法 无效 - 驳回

封装结构及组件连接的方法
摘要：
本揭露公开一种封装结构及组件连接的方法，其中所述封装结构包括第一基底，所述第一基底包含第一线路与连接至所述第一线路的至少一第一接点；第二基底，所述第二基底包含第二线路与连接至所述第二线路的至少一第二接点，所述至少一第一接点与所述至少一第二接点彼此部分物理性接触或彼此部分化学性界面反应接触；以及至少一第三接点，所述至少一第三接点包围所述至少一第一接点与所述至少一第二接点，且所述第一基底至少通过所述至少一第一接点与所述至少一第二接点与所述第二基底电连接。
摘要（英）：

A package structure and a method for connecting components are provided, in which the package includes a first substrate including a first wiring and at least one first contact connecting to the firstwiring; a second substrate including a second wiring and at least one second contact connecting to the second wiring, the at least one first contact and the at least one second contact partially physically contacting with each other or partially chemically interface reactive contacting with each other; and at least one third contact surrounding the at least one first contact and the at least onesecond contact. The first substrate and the second substrate are electrically connected with each other at least through the at least one first contact and the at least one second contact.

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