Disclosed is a semiconductor device wherein a first semiconductor module (30) constitutes an upper arm, and has a plurality of semiconductor chips (301) connected to each other in parallel, a sealingresin body (300), and a positive electrode terminal (305). A second semiconductor module (40) constitutes a lower arm, and has a plurality of semiconductor chips (401) connected to each other in parallel, a sealing resin body (400), and a negative electrode terminal (406). In the X direction orthogonal to the Z direction, i.e., the laminating direction, the first and second semiconductor modules are disposed by being aligned with each other. The first semiconductor module and/or the second semiconductor module has a relay terminal (307, 408) that performs electrical relaying between the low potential-side electrode of the semiconductor chip (301) and the high potential-side electrode of the semiconductor chip (401).