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发明公开
CN110335823A 带有悬臂式焊盘的叠层半导体封装体 审中-实审

带有悬臂式焊盘的叠层半导体封装体
摘要：
一个或多个实施例涉及包括多个叠层封装体的带有一个或多个悬臂式焊盘的半导体封装体。在一个实施例中，凹陷位于封装体的衬底中、面朝悬臂式焊盘。悬臂式焊盘包括其上形成有导电球的导电焊盘。悬臂式焊盘被配置成用于吸收作用在封装体上的应力。
摘要（英）：

One or more embodiments are directed to semiconductor packages, including stacked packages, with one or more cantilever pads. In one embodiment a recess is located in a substrate of the package facingthe cantilever pad. The cantilever pad includes a conductive pad on which a conductive ball is formed. The cantilever pad is configured to absorb stresses acting on the package.

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