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发明公开
CN110416163A 摄像器件模块、摄像系统、摄像器件封装和制造方法 审中-实审

摄像器件模块、摄像系统、摄像器件封装和制造方法
摘要：
本发明提供摄像器件模块、摄像系统、摄像器件封装和制造方法。根据本公开，满足Tgp>Tgf、αf1
摘要（英）：

The invention provides an imaging device module, an imaging system, an imaging device package, and a manufacturing method. According to the disclosure, a relationship of Tgp>Tgf, [alpha]f1<[alpha]PCB1, and (Tgp-To)*[alpha]PCB1<(Tgf-To)*[alpha]f1+(Tgp-Tgf)*[alpha]f2 or a relationship of Tgp

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