The invention discloses a collimation light path structure for adjusting parallelism of a chip sucker and a substrate sucker and solves problems of low quality and high rejection rate of bonded products due to the fact that parallelism between a chip sucker and a substrate sucker can not be adjusted in place through self-adaptive adjustment of bonding equipment before bonding in the prior art. Thecollimation light path structure is advantaged in that the same target is imaged in a collimation imaging camera through double collimation imaging light paths, in the imaging light path, except a reflecting mirror of the chip sucker with a reflecting mirror surface and a reflecting mirror of the substrate sucker with a reflecting mirror surface, all prisms are positioned in a preset optical system, the position and the angle of each prism are constant, and the position of an image A generated by the target can be changed by only adjusting the reflecting mirror of the chip sucker with the reflector surface, so adjustment of the parallelism between the chip sucker and the substrate sucker can be realized by adjusting the position of the chip sucker with the reflector surface. The collimation light path structure is advantaged in that parallelism of the chip sucker and the substrate sucker is greatly improved.