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发明公开
CN110871324A 接合装置以及接合体的制造方法 审中-公开

接合装置以及接合体的制造方法
摘要：
本发明提供一种能够将尺寸小型化的接合装置以及使用小型的接合装置的接合体的制造方法。接合装置具有支承台和限制部件，该支承台具有载置面。对于载置面而言，基板以使半导体元件的表面电极朝上的方式载置于载置面。在该表面电极重叠有配线部件。限制部件通过在与载置面之间夹住设置有半导体元件的基板和配线部件而限制表面电极与配线部件向相互分离的方向移动。另外，接合装置也具有激光装置。激光装置通过经由限制部件的孔对配线部件的表面照射激光而对表面电极与配线部件的接合界面进行局部加热。
摘要（英）：

Provided are a welding apparatus having a reduced size. A welding apparatus includes a support base having a placement surface, and a restriction member. A substrate with a semiconductor element disposed thereon is placed on the placement surface such that a surface electrode of the semiconductor element faces upward. A wiring member is placed on the surface electrode. The restriction member restricts movement of the surface electrode and the wiring member in the directions away from each other, by holding the substrate with the semiconductor element disposed thereon and the wiring member, between the placement surface and the restriction member. The welding apparatus further includes a laser device. The laser device locally heats a welding interface between the surface electrode and the wiring member by irradiating a laser beam onto the surface of the wiring member through a hole in the restriction member.

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