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发明公开
CN111194251A 助焊剂和焊锡膏 有权

助焊剂和焊锡膏
摘要：
本发明提供润湿扩展性提高、并且可抑制反润湿的发生的助焊剂和使用了该助焊剂的焊锡膏。助焊剂包含总计为0.5wt%以上且20wt%以下的、作为油酸与亚油酸的反应物的二聚酸、作为油酸与亚油酸的反应物的三聚酸、在作为油酸与亚油酸的反应物的二聚酸中添加了氢的氢化二聚酸、或在作为油酸与亚油酸的反应物的三聚酸中添加了氢的氢化三聚酸中的任一种；或者作为油酸与亚油酸的反应物的二聚酸、作为油酸与亚油酸的反应物的三聚酸、在作为油酸与亚油酸的反应物的二聚酸中添加了氢的氢化二聚酸、和在作为油酸与亚油酸的反应物的三聚酸中添加了氢的氢化三聚酸中的两种以上。焊锡膏包含该助焊剂和金属粉。
摘要（英）：

Provided are a flux which has improved wet-spreadability and is capable of preventing the occurrence of dewetting and a solder paste with the use of the flux. The flux comprises one member selected from among a dimer acid that is a product of a reaction between oleic acid and linolic acid, a trimer acid that is a product of a reaction between oleic acid and linolic acid, a hydrogenated dimer acid prepared by adding hydrogen to a dimer acid that is a product of a reaction between oleic acid and linolic acid and a hydrogenated trimer acid prepared by adding hydrogen to a trimer acid that is a product of a reaction between oleic acid and linolic acid, or two or more members selected from among a dimer acid that is a product of a reaction between oleic acid and linolic acid, a trimer acid that is a product of a reaction between oleic acid and linolic acid, a hydrogenated dimer acid prepared by adding hydrogen to a dimer acid that is a product of a reaction between oleic acid and linolic acid and a hydrogenated trimer acid prepared by adding hydrogen to a trimer acid that is a product of a reaction between oleic acid and linolic acid in a total amount of 0.5-20 wt% inclusive. The solder paste comprises the flux and a metal powder.

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