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发明授权
CN1168143C 金－合金细导线及其制造方法和应用 失效 - 权利终止

金－合金细导线及其制造方法和应用
摘要：
本发明涉及由金及0.6-2重量%的镍制成的合金或用金及0.1-2重量%的镍、0.0001-0.1重量%的碱土金属和/或稀土金属、以及有时还加入0.1-1.0重量%的铂和/或钯制成的细导线，其特征是具有优良的导电性能及良好的强度/伸长率关系。它们适宜作连接导线，还可在倒装技术(Flip-Chips)中用于制成接触凸缘。
摘要（英）：

A fine wire made of an alloy of gold which contains 0.6 to 2 weight % of nickel, or an alloy of gold which contains 0.1 to 2 weight % of nickel, 0.0001 to 0.1 weight % of alkaline earth metal and/or rare earth metal, and optionally 0.1 to 1.0 weight % of platinum and/or palladium . The fine wire is distinguished by a favorable electrical conductivity and a good ratio of strength to elongation. The fine wire is suitable both for wire bonding of semiconductor devices and for producing the ball bumps of flip-chips.

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