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发明授权
CN1949937B 传感器附接结构和超声波传感设备 失效 - 权利终止

传感器附接结构和超声波传感设备
摘要：
一种传感器附接结构包括：用来接收超声波的声学接收元件(20)；附接至声学接收元件的超声波传感器(10)。该超声波传感器包括半导体基片(11)，该半导体基片具有彼此相反的第一和第二表面以及从半导体基片的第一表面凹进从而在半导体基片中形成膜片(12)的基片凹陷部(13)。而且，盖元件(30)定位于声学接收元件和半导体基片之间以覆盖半导体基片的第二表面。另外，盖元件具有结合至声学接收元件的第一表面，以及在膜片的外周边区域处结合至半导体基片的第二表面同时在盖元件和膜片之间形成缝隙(31)的第二表面。
摘要（英）：

A sensor attachment structure includes a sound receiving member for receiving an ultrasound, an ultrasonic sensor attached to the sound receiving member. The ultrasonic sensor includes a semiconductor substrate having first and second surfaces opposite to each other and a substrate recess portion recessed from the first surface of the semiconductor substrate so as to form a membrane in the semiconductor substrate. Furthermore, a cap member is located between the sound receiving member and the semiconductor substrate to cover the second surface of the semiconductor substrate. In addition, the cap member has a first surface bonded to the sound receiving member, and a second surface that is bonded to the second surface of the semiconductor substrate at an outer periphery section of the membrane while having a gap between the cap member and the membrane.

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