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实用新型
CN202948918U 封装基板及半导体元件的封装结构 失效 - 权利终止

封装基板及半导体元件的封装结构
摘要：
本实用新型公开一种封装基板及半导体元件的封装结构。封装基板包括一介电层、一第一导电层、一第二导电层以及一接合垫。介电层具有一上表面以及一下表面。第一导电层内埋于介电层中，并显露一第一表面于上表面。第一表面切齐上表面。第二导电层内埋于介电层中与第一导电层接触，并显露一第二表面于下表面。第二表面切齐于下表面。接合垫部分地或全部地内埋于第一导电层与介电层中，以使接合垫的周围同时被第一导电层与介电层的侧壁限制于凹穴内。
摘要（英）：

The utility model discloses a package substrate and a package structure of a semiconductor component. The package substrate comprises a dielectric layer, a first conductive layer, a second conductive layer and a joint cushion. The dielectric layer is provided with an upper surface and a lower surface. The first conductive layer is embedded in the dielectric layer and a first surface appears on the upper surface. The first surface is flush with the upper surface. The second conductive layer is embedded in the dielectric layer and is in contact with the first conductive layer and a second surface appears on the lower surface. The second surface is flush with the lower surface. The joint cushion is embedded in the dielectric layer and the first conductive layer partly or completely, and the periphery of the joint cushion can be limited in a pit by side walls of the first conductive layer and the dielectric layer.

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