The utility model provides a mounting structure of electronic component can reduce the installation space who installs in mounting substrate's electronic component to can carry out the high density installation of electronic component for mounting substrate. Possess mounting substrate, have first interarea and second interarea a surface mounting assembly, have the 2nd surface mounting assembly of third interarea and fourth interarea and have the electronic component of the 5th interarea. A surface mounting assembly possesses the first outside terminal that tangible becomes the second interarea at least, and the 2nd surface mounting assembly possesses the second outside terminal that tangible becomes the fourth interarea at least. Electronic component utensil tangible becomes a connecting terminal and the 2nd connecting terminal of the 5th interarea, and the configuration is the 5th interarea and second interarea and fourth interarea difference opposition. A connecting terminal is connected with first outside terminal, and the 2nd connecting terminal is connected with the second outside terminal.