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实用新型
CN206893609U 芯片封装 有权

芯片封装
摘要：
本公开涉及芯片封装。本实用新型要解决的一个技术问题是提供改进的芯片封装。在一些实施例中，芯片封装包括：管芯底盘；一个或多个管芯支撑件；以及安装在管芯底盘和所述一个或多个管芯支撑件上的管芯，所述管芯的至少一个表面的面积大于管芯底盘的至少一个表面的面积。通过本实用新型，可以获得改进的芯片封装。
摘要（英）：

The utility model relates to chip package. The utility model discloses a technical problem who solves provides modified chip package. In some embodiments, chip package includes: the tube core chassis,one or more tube core support piece, and install the tube core chassis with tube core on the one or more tube core support piece, at least one surperficial area of tube core is greater than at leastone surperficial area on tube core chassis. Through the utility model discloses, can obtain modified chip package.

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