The utility model relates to an active evaporating radiation device for a power semiconductor device or a module. The device makes a shell of the power semiconductor device or the module into a hollow closed shell body, and insulation, evaporation and cooling mediums are filled in the hollow closed shell body; the upper part of the shell is provided with a condenser, and the shell and the condenser are communicated through a pipe. The utility model uses the shell body of the semiconductor device or the module as the shell of an evaporator, and a totally enclosed cooling circulation system is formed; accordingly, the utility model has high cooling and radiation efficiency, which is 350 times greater than the heat conductivity of a good conductor (such as solid copper) having the same geometric sizes; the centralization work and the heat radiation of multiple power devices or modules, particularly devices or modules having different power and different heat productivity, under the condition of integral height or integration height can be realized. The utility model is suitable for cooling high heat-density large-power devices and assemblies of large-power devices which are assembled with high density or are integrated.