A temperature and process variation compensated TTL to ECL translator buffer includes an input voltage translator (2) and a reference voltage translator (14) formed on the same integrated circuit chip by the same process steps. The input voltage translator (2) and the reference voltage translator (14) each include the same number of forward biased diode voltage drops and base emitter voltage drops during operation and each forward biased junction is operated' at the same current density to cause the input voltage translator (2) and the reference voltage translator (14) to be equally affected by process and temperature variations thereby compensating for the variations.