发明公开
EP0090900A1 Process of manufacturing printed wiring boards and printed wiring boards manufactured by the same
失效
一种用于印刷电路板和由该方法生产的印刷电路板的制造过程。
- 专利标题： Process of manufacturing printed wiring boards and printed wiring boards manufactured by the same
- 专利标题（中）： 一种用于印刷电路板和由该方法生产的印刷电路板的制造过程。
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申请号： EP82400623.3申请日： 1982-04-05
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公开(公告)号： EP0090900A1公开(公告)日： 1983-10-12
- 发明人: Nishihara, Haruo , Suzuki, Yoshiaki
- 申请人： KANTO KASEI CO., LTD.
- 申请人地址： No. 73, Ikeda-cho 4-chome Yokosuka-shi Kanagawa-ken JP
- 专利权人： KANTO KASEI CO., LTD.
- 当前专利权人： KANTO KASEI CO., LTD.
- 当前专利权人地址： No. 73, Ikeda-cho 4-chome Yokosuka-shi Kanagawa-ken JP
- 代理机构： Polus, Camille
- 主分类号： H05K3/42
- IPC分类号： H05K3/42
摘要：
A printed wiring board of this invention can be obtained by the steps of: making holes in the necessary portion of a copper-clad laminate; forming a catalytic layer on said hole walls and copper foil by pretreatment for electroless plating; forming an etching resist film on necessary lands and circuits; melting-off the copper foil and catalytic layer on the unnecessary portion of said copper-clad laminate by etching; melting-off or retaining said etching resist film; and forming an electroless copper plated film on said catalytic layer: or forming a solder resist film on the necessary portion before or after said electroless copper plated film is formed.
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