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1.发明授权
公开(公告)号：EP0088852B1
公开(公告)日：1986-07-30
申请号：EP82400798.3
申请日：1982-04-30
IPC分类号： C23C18/40
CPC分类号： C23C18/1617 , Y10S204/13
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2.发明公开
公开(公告)号：EP0088852A1
公开(公告)日：1983-09-21
申请号：EP82400798.3
申请日：1982-04-30
IPC分类号： C23C18/40
CPC分类号： C23C18/1617 , Y10S204/13
摘要： A process for regenerating electroless plating bath comprising the steps of:
(i) continuously or intermittently taking out a part or the whole of chelating agent-containing copper electroless plating bath (12) from an electroless plating tank, followed by removing off the copper ion content from said bath;
(ii) acidifying the thus obtained solution for precipitating the chelating agent therefrom and recovering the precipitated chelating agent;
(iii) supplying said recovered chelating agent to an anodic cell separated by an exchange membrane from a cathodic cell having cathode, said anodic cell having copper anode, wherein in case a neutral or alkaline electrolyte solution is supplied to said cathodic cell said partitioning membrane is an anion exchange membrane or cation exchange membrane, while in case an acidic electrolyte solution is supplied to said cathodic cell said partitioning membrane is a cation exchange membrane, and applying direct current between both electrode; and
(iv) then, recycling the solution within said anodic cell to said electroless plating tank, and a regenerating apparatus of electroless plating bath including
(a) a copper-precipitating means for decomposing the copper chelate contained in the electroless copper plating bath and for precipitating the copper ion,
(b) a chelating agent-recovering means for changing the pH of the solution to precipitate the chelating agent and recover, and
(c) an electrolytic means comprising an anodic cell (33) and a cathodic cell (35) separated by means of an ion exchange membrane (37), said anodic cell having a copper anode (39) therein, said cathodic cell having a cathode therein.-
3.发明授权
公开(公告)号：EP0090900B1
公开(公告)日：1987-02-11
申请号：EP82400623.3
申请日：1982-04-05
发明人： Nishihara, Haruo , Suzuki, Yoshiaki
IPC分类号： H05K3/42
CPC分类号： H05K3/428 , H05K2203/1423
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4.发明公开Process of manufacturing printed wiring boards and printed wiring boards manufactured by the same 失效一种用于印刷电路板和由该方法生产的印刷电路板的制造过程。
公开(公告)号：EP0090900A1
公开(公告)日：1983-10-12
申请号：EP82400623.3
申请日：1982-04-05
发明人： Nishihara, Haruo , Suzuki, Yoshiaki
IPC分类号： H05K3/42
CPC分类号： H05K3/428 , H05K2203/1423
摘要： A printed wiring board of this invention can be obtained by the steps of: making holes in the necessary portion of a copper-clad laminate; forming a catalytic layer on said hole walls and copper foil by pretreatment for electroless plating; forming an etching resist film on necessary lands and circuits; melting-off the copper foil and catalytic layer on the unnecessary portion of said copper-clad laminate by etching; melting-off or retaining said etching resist film; and forming an electroless copper plated film on said catalytic layer: or forming a solder resist film on the necessary portion before or after said electroless copper plated film is formed.
摘要翻译： 本发明的印刷电路板可以通过以下步骤来获得：使在敷铜层压板的必要部分的孔; 形成所述孔壁和通过预处理无电解电镀铜箔上的催化层; 蚀刻的形成抗蚀剂膜，在必要的土地和电路; 熔断上通过蚀刻所述覆铜层压板的不必要的部分的铜箔和催化层; 熔化关闭或保持所述蚀刻抗蚀剂膜; 和无电镀铜的形成镀电影在所述催化层; 或之前或之后的化学镀铜。所述电影被形成在形成了阻焊薄膜上必要部分。
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