摘要:
A nonconductor product is immersed in a semiconductor-powder-suspended liquid and irradiated with light in the liquid to form polar radicals on the surface of the nonconductor product, and electroless plating is conducted on the polar radical-formed surface. Electroless plating is conducted after a resin product is ultraviolet-treated by irradiating it with a UV ray via water or an aqueous solution. An electroless plating or electroplating is further conducted on the electroless-plated layer with a dissimilar or similar metal. In this way, a plated nonconductor product can be obtained that is free from problems of environmental pollution and waste liquid treatment, and has a plating layer and a nonconductor product surface firmly bonded together. When resin is used, the thermal distortion of a resin material is prevented, and the bonding strength of a plating film can be improved.
摘要:
Object A method of forming a plate layer with extremely high adhesiveness on a surface of a non-conductive product. Solution A method of plating a non-conductive product comprising the steps of:
forming a coating film on necessary portions of a surface of the non-conductive product with a conductive paint having the following composition of solid ingredients:
(A) resin vehicles 20 to 80 weight % (B) conductive whisker 80 to 20 weight %, and
executing electroless plating on a surface of the coating film, or a method for improving adhesiveness of a plate layer by forming , when forming a coating film, microvoids in a surface of the coating film.
摘要:
This invention is directed to a method of copper-nickel-chromium bright electroplating which provides excellent corrosion resistance, characterized in that said bright electroplating film comprising a copper and a nickel plating layers formed on a basis material or a nickel plating layer directly formed on a basis material, a microporous layer of a thickness of 0.2-2µm codeposited on said nickel plating layer by adding calcium salt and titanium oxide to Watts bath type of nickel plating bath, chromium plating layer with a thickness of 0.01-0.25µm on said microporous layer and a chromium plating surface with micropores of 20000-500000/cm², and is directed to the plating films obtained by the method.
摘要:
A printed wiring board of this invention can be obtained by the steps of: making holes in the necessary portion of a copper-clad laminate; forming a catalytic layer on said hole walls and copper foil by pretreatment for electroless plating; forming an etching resist film on necessary lands and circuits; melting-off the copper foil and catalytic layer on the unnecessary portion of said copper-clad laminate by etching; melting-off or retaining said etching resist film; and forming an electroless copper plated film on said catalytic layer: or forming a solder resist film on the necessary portion before or after said electroless copper plated film is formed.
摘要:
A resistor (5) is provided in a conductor layer (4) by being electrically connected thereto so that a surface of the resistor (5) and that of the conductor layer (4) is included in one plane in the direction of the thickness of a printed board (2) with the conductor layer (4) provided in a base (2') for a printed circuit.
摘要:
A process for regenerating electroless plating bath comprising the steps of:
(i) continuously or intermittently taking out a part or the whole of chelating agent-containing copper electroless plating bath (12) from an electroless plating tank, followed by removing off the copper ion content from said bath; (ii) acidifying the thus obtained solution for precipitating the chelating agent therefrom and recovering the precipitated chelating agent; (iii) supplying said recovered chelating agent to an anodic cell separated by an exchange membrane from a cathodic cell having cathode, said anodic cell having copper anode, wherein in case a neutral or alkaline electrolyte solution is supplied to said cathodic cell said partitioning membrane is an anion exchange membrane or cation exchange membrane, while in case an acidic electrolyte solution is supplied to said cathodic cell said partitioning membrane is a cation exchange membrane, and applying direct current between both electrode; and (iv) then, recycling the solution within said anodic cell to said electroless plating tank, and a regenerating apparatus of electroless plating bath including
(a) a copper-precipitating means for decomposing the copper chelate contained in the electroless copper plating bath and for precipitating the copper ion, (b) a chelating agent-recovering means for changing the pH of the solution to precipitate the chelating agent and recover, and (c) an electrolytic means comprising an anodic cell (33) and a cathodic cell (35) separated by means of an ion exchange membrane (37), said anodic cell having a copper anode (39) therein, said cathodic cell having a cathode therein.
摘要:
A nonconductor product is soaked in a solution suspending semiconducting powder and is subjected to light irradiation in the solution so that the polar group is formed on the surface of the nonconductor product, and then electroless plating is performed on the surface on which the polar group is formed. A resin product is subjected to electroless plating after ultraviolet treatment in which ultraviolet rays are irradiated through water or a solution is performed. Further, electroless plating or electroplating with a different or the same kind of metal is performed on the electroless-plated layer formed by electroless plating. With the method like this, the plated nonconductor product which does not cause the problems such as environmental pollution and waste liquid treatment, and whose surface and the plated coating is firmly adhered to each other, and, when a resin product is used as a subject to be plated, deformation by heat of the resin product can be prevented, and moreover, adherent strength of the plated coating can be improved.