Method of copper-nickel-chromium bright electroplating which provides excellent corrosion resistance and plating film obtained by the method
    3.
    发明公开
    Method of copper-nickel-chromium bright electroplating which provides excellent corrosion resistance and plating film obtained by the method 失效
    一种用于在具有通过该方法获得优异的耐腐蚀性和镀层光泽的铜 - 镍 - 铬的电镀工艺。

    公开(公告)号:EP0431228A1

    公开(公告)日:1991-06-12

    申请号:EP89403369.5

    申请日:1989-12-05

    发明人: Yokoi, Hiroshi

    IPC分类号: C25D5/14 C25D15/02

    摘要: This invention is directed to a method of copper-nickel-chromium bright electroplating which provides excellent corrosion resistance, character­ized in that said bright electroplating film comprising a copper and a nickel plating layers formed on a basis material or a nickel plating layer directly formed on a basis material, a microporous layer of a thickness of 0.2-2µm codeposited on said nickel plating layer by adding calcium salt and titanium oxide to Watts bath type of nickel plating bath, chromium plating layer with a thickness of 0.01-0.25µm on said microporous layer and a chromium plating surface with micropores of 20000-500000/cm², and is directed to the plating films obtained by the method.

    摘要翻译: 本发明涉及铜 - 镍 - 铬光亮电镀的方法,其提供优异的耐腐蚀性,在特征的所述亮的电镀薄膜,其包括铜和形成在基体材料或镀镍层上的镍镀层直接形成在一个 基料,通过添加钙盐和氧化钛以瓦特浴型镍的电镀浴,镀铬层的厚度为0时01分至0点25微米上形成厚度为共沉积所述镍镀层上0.2-2微米的微孔层 所述微孔层和具有20000-500000微孔的镀铬表面/厘米<2>,并且涉及通过所述方法获得的镀敷膜。

    Process of manufacturing printed wiring boards and printed wiring boards manufactured by the same
    6.
    发明公开
    Process of manufacturing printed wiring boards and printed wiring boards manufactured by the same 失效
    一种用于印刷电路板和由该方法生产的印刷电路板的制造过程。

    公开(公告)号:EP0090900A1

    公开(公告)日:1983-10-12

    申请号:EP82400623.3

    申请日:1982-04-05

    IPC分类号: H05K3/42

    CPC分类号: H05K3/428 H05K2203/1423

    摘要: A printed wiring board of this invention can be obtained by the steps of: making holes in the necessary portion of a copper-clad laminate; forming a catalytic layer on said hole walls and copper foil by pretreatment for electroless plating; forming an etching resist film on necessary lands and circuits; melting-off the copper foil and catalytic layer on the unnecessary portion of said copper-clad laminate by etching; melting-off or retaining said etching resist film; and forming an electroless copper plated film on said catalytic layer: or forming a solder resist film on the necessary portion before or after said electroless copper plated film is formed.

    摘要翻译: 本发明的印刷电路板可以通过以下步骤来获得:使在敷铜层压板的必要部分的孔; 形成所述孔壁和通过预处理无电解电镀铜箔上的催化层; 蚀刻的形成抗蚀剂膜,在必要的土地和电路; 熔断上通过蚀刻所述覆铜层压板的不必要的部分的铜箔和催化层; 熔化关闭或保持所述蚀刻抗蚀剂膜; 和无电镀铜的形成镀电影在所述催化层; 或之前或之后的化学镀铜。所述电影被形成在形成了阻焊薄膜上必要部分。

    Printed circuit board
    8.
    发明公开
    Printed circuit board 失效
    印刷电路板

    公开(公告)号:EP0719079A1

    公开(公告)日:1996-06-26

    申请号:EP95119116.2

    申请日:1995-12-05

    IPC分类号: H05K1/16

    摘要: A resistor (5) is provided in a conductor layer (4) by being electrically connected thereto so that a surface of the resistor (5) and that of the conductor layer (4) is included in one plane in the direction of the thickness of a printed board (2) with the conductor layer (4) provided in a base (2') for a printed circuit.

    摘要翻译: 通过电连接到导体层(4)中,电阻器(5)被设置在导体层(4)中,使得电阻器(5)的表面和导体层(4)的表面被包括在厚度方向上的一个平面中 印刷电路板(2),其中导体层(4)设置在用于印刷电路的基座(2')中。

    A process for regenerating electroless plating bath and a regenerating apparatus of electroless plating bath
    9.
    发明公开

    公开(公告)号:EP0088852A1

    公开(公告)日:1983-09-21

    申请号:EP82400798.3

    申请日:1982-04-30

    IPC分类号: C23C18/40

    CPC分类号: C23C18/1617 Y10S204/13

    摘要: A process for regenerating electroless plating bath comprising the steps of:

    (i) continuously or intermittently taking out a part or the whole of chelating agent-containing copper electroless plating bath (12) from an electroless plating tank, followed by removing off the copper ion content from said bath;
    (ii) acidifying the thus obtained solution for precipitating the chelating agent therefrom and recovering the precipitated chelating agent;
    (iii) supplying said recovered chelating agent to an anodic cell separated by an exchange membrane from a cathodic cell having cathode, said anodic cell having copper anode, wherein in case a neutral or alkaline electrolyte solution is supplied to said cathodic cell said partitioning membrane is an anion exchange membrane or cation exchange membrane, while in case an acidic electrolyte solution is supplied to said cathodic cell said partitioning membrane is a cation exchange membrane, and applying direct current between both electrode; and
    (iv) then, recycling the solution within said anodic cell to said electroless plating tank, and a regenerating apparatus of electroless plating bath including

    (a) a copper-precipitating means for decomposing the copper chelate contained in the electroless copper plating bath and for precipitating the copper ion,
    (b) a chelating agent-recovering means for changing the pH of the solution to precipitate the chelating agent and recover, and
    (c) an electrolytic means comprising an anodic cell (33) and a cathodic cell (35) separated by means of an ion exchange membrane (37), said anodic cell having a copper anode (39) therein, said cathodic cell having a cathode therein.

    METHOD OF PLATING NONCONDUCTOR PRODUCT
    10.
    发明公开
    METHOD OF PLATING NONCONDUCTOR PRODUCT 有权
    VERFAHREN ZUM BESCHICHTEN EINES NICHTLEITERPRODUKTS

    公开(公告)号:EP1445347A1

    公开(公告)日:2004-08-11

    申请号:EP02762884.1

    申请日:2002-08-28

    IPC分类号: C23C18/20

    摘要: A nonconductor product is soaked in a solution suspending semiconducting powder and is subjected to light irradiation in the solution so that the polar group is formed on the surface of the nonconductor product, and then electroless plating is performed on the surface on which the polar group is formed. A resin product is subjected to electroless plating after ultraviolet treatment in which ultraviolet rays are irradiated through water or a solution is performed. Further, electroless plating or electroplating with a different or the same kind of metal is performed on the electroless-plated layer formed by electroless plating. With the method like this, the plated nonconductor product which does not cause the problems such as environmental pollution and waste liquid treatment, and whose surface and the plated coating is firmly adhered to each other, and, when a resin product is used as a subject to be plated, deformation by heat of the resin product can be prevented, and moreover, adherent strength of the plated coating can be improved.

    摘要翻译: 将非导体产物浸泡在悬浮半导体粉末的溶液中,并在溶液中进行光照射,使得极性基团形成在非导体产品的表面上,然后在极性基团的表面上进行无电镀 形成。 紫外线处理后,通过水或溶液照射紫外线,对树脂制品进行化学镀。 此外,在通过化学镀形成的化学镀层上进行化学镀或具有不同或相同种类的金属的电镀。 采用这样的方法,不会引起诸如环境污染和废液处理等问题的电镀非导体产品,并且其表面和镀层彼此牢固地粘合,并且当将树脂产品用作主体 可以防止树脂制品的热变形,并且可以提高镀覆层的粘附强度。