发明公开
- 专利标题： Interconnection of integrated circuits
- 专利标题（中）： 集成电路互连
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申请号： EP83111625申请日： 1983-11-21
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公开(公告)号： EP0110285A3公开(公告)日： 1985-11-21
- 发明人: Jasper, Francis Emile , Peeters, Josephus Bonifacius , Browne, Edward Keith
- 申请人： PRUTEC LIMITED
- 专利权人： PRUTEC LIMITED
- 当前专利权人： PRUTEC LIMITED
- 优先权： GB8233893 19821127
- 主分类号： H01L23/52
- IPC分类号： H01L23/52 ; H01L21/58 ; H01L21/312 ; H01L21/90
摘要：
The invention describes a method of producing an electrical circuit incorporating integrated circuits on semiconductor chips, which comprises mounting the electrical components (10) which are to constitute the circuit including the unpackaged semiconductor chips on an insulating substrate (12) in such a manner that the contact areas of the components lie in a substantially flat plane, and depositing a conductive pattern over the substrate to establish electrical connection between the components of the circuit.
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